ÀÏÀß·¯Ã¤¿ë°ü
ä¿ëÁ¤º¸
ÀÎÀç°Ë»ö
±³À°Á¤º¸
ÇìµåÇåÆÃ
½º¸¶Æ®Å¸¿î
ȸ¿ø¼­ºñ½º
À̷¼­ µî·Ï
ä¿ë°ø°í µî·Ï

¹ÝµµÃ¼»ç¾÷ºÎ System LSI´ã´ç °æ·Â»ç¿ø ä¿ë

»ï¼ºÀüÀÚÀÇ µðÁöÅÐ ±â¼úÀº °ø°£Àû, ½Ã°£Àû Á¦¾àÀ» ¶Ù¾î³Ñ¾î ±â¼ú°ú ½ÃÀå, ¹®È­ µî ¿ì¸® »ýÈ°ÀÇ Àü¹ÝÀ» º¯È­½ÃÅ°°í ÀÖÀ¸¸ç, ÀÌ·¯ÇÑ º¯È­µéÀº Àü ÀηùÀÇ »îÀ» º¸´Ù ..  

¾÷Á¾ Àü±â/ÀüÀÚ/Åë½Å ÀÚº»±Ý
±â¾÷ÇüÅ ´ë±â¾÷ ¸ÅÃâÇöȲ
´ëÇ¥ÀÚ »ç¿ø¼ö
ȸ»çÁÖ¼Ò
  • ÇöÀç ä¿ëÁ¤º¸¸¦ º¹»çÇÕ´Ï´Ù.
  • ÇöÀç ä¿ëÁ¤º¸¸¦ ÇÁ¸°ÆÃÇÕ´Ï´Ù.




Á÷Á¾ ¹ÝµµÃ¼¡¤µð½ºÇ÷¹ÀÌ¡¤±¤ÇÐ, ¿¬±¸°³¹ß¡¤R&D, »ý»ê°ü¸®¡¤Ç°Áú°ü¸®¡¤Ç°Áúº¸Áõ
±Ù¹«ÇüÅ Á¤±ÔÁ÷ ä¿ëÁ÷±Þ -
¸ðÁýÀοø - ³ªÀÌ -
°æ·Â °æ·Â ±Þ¿©Á¶°Ç ´ç»ç±ÔÁ¤
Çз ´ëÁ¹ ÀÌ»ó Á¢¼ö±â°£ Á¢¼ö±â°£ÀÌ Áö³µ½À´Ï´Ù
 [ȨÆäÀÌÁöÁ¢¼ö]

Á¢¼ö±â°£ÀÌ Áö³µ½À´Ï´Ù

* ´ã´ç¾÷¹«
»ó¼¼Á¶°Ç

¸ðÁýºÎ¹®

  ¹ÝµµÃ¼ System LSI ´ã´ç (°øÁ¤/¼³ºñ/Á¦Á¶±â¼ú/Design Infra/Ç°Áú)

 

ÁÖ¿ä¾÷¹«

 ¡á Advanced Process Development ¹× Integration

   - Cleaning/CMP/Etch/Lithography (including OPC/RET)/Thin Film (including Silicide)

   - High-K/Metal Gate

   - SiO2/SiON Gate Dielectrics

   - Ultra Low-K

   - Ultra Shallow Junction (including RTA and LSA)

   - Strain Engineering

   - FEOL/BEOL Process Integration

 

 ¡á ¹ÝµµÃ¼ Àåºñ Àü¹®°¡(Photo, Etch, CVD, CMP, Metal, Diffsion, IMP, Clean)

   - Àåºñ ¼³°è ¹× °³¹ß, °ü¸®, System Engineering

   - °øÁ¤º° Defect source Áø´Ü ¹× Á¦¾î, maintenance & Improve

   - Input parameter¿Í defect°úÀÇ °ü°è ºÐ¼®, º¯È­ monitoring

   - ¿ä¼Ò ±â¼ú¿¡ ´ëÇÑ ¿ø¸® ¹× mechanism

 

 ¡á Device & Reliability Engineering

   - Device physics and optimization / Device Reliability (including BEOL reliability)

   - Device Modeling (including strain modeling)

 

 ¡á Design Infra Development

   - DFM Engineering, Design Rule °³¹ß

   - ¼³°è È¿À²È­ Infra System ±¸Ãà ¹× ¿î¿µ

 

 ¡á Product Engineering & Test

 

 ¡á Factory Automation & IT Engineering

   - FAB Automation (Scheduling, Simulation, AMHS)

   - IT Engineering (PLM, MIS, MES, FDC)

   - Yield Management System( Statistical  Analysis,  Modeling)

 

 ¡á Manufacturing Infra Technology

   - Material development and analysis

   - Nano-contamination control engineering

 

 ¡á Marketing & Customer Engineering

   - Product Marketing, Technology Marketing

   - Customer Engineering (Technical Interface, Program Management)

 

 ¡á Quality Engineering

   - Customer interface, Quality system or engineering, Technical support

   - Process reliability, Device degradation modeling, Circuit reliability

 

 ¡Ø ±Ù¹«Áö : ±âÈï ¹ÝµµÃ¼»ç¾÷Àå(°æ±âµµ ¿ëÀÎ ¼ÒÀç)

 

Áö¿øÀÚ°Ý

 ¡á Çлç ÀÌ»ó ÇÐÀ§ ¼ÒÁöÀÚ·Î °ü·ÃºÎ¹® °æ·ÂÀÚ

    - Çлç ÇÐÀ§ ¼ÒÁöÀÚ·Î 4³â ÀÌ»ó °æ·Â ¼ÒÁöÀÚ

    - ¼®»ç ÇÐÀ§ ¼ÒÁöÀÚ·Î 2³â ÀÌ»ó °æ·Â ¼ÒÁöÀÚ

    - ¹Ú»ç ÇÐÀ§ ¼ÒÁöÀÚ(Á¹¾÷ ¿¹Á¤ÀÚ °¡´É)

 

Áö¿ø¹æ¹ý

 ¡á È­¸é ¾Æ·¡ "Áö¿øÇϱâ" ¹öÆ° Ŭ¸¯ ÈÄ Áö¿ø¼­ ÀÛ¼º

    - Áö¿ø¼­ ÀÛ¼º ½Ã ÷ºÎÀÇ Áö¿ø¼­ ¾ç½Ä ÀÛ¼º ÈÄ ÇÊ Ã·ºÎ

 

¸ðÁýÀοø

  00¸í

 

ÀüÇüÀýÂ÷

      Áö¿ø¼­ÀÛ¼ºÁö¿ø¼­°ËÅä¸éÁ¢ÀüÇü°Ç°­°ËÁøÃÖÁ¾ÇÕ°Ý

±âŸ

  ¡Ø °¢Á¾ Áõºù¼­·ù(¾îÇÐ, ÇÐÀ§, °æ·Â°ü·Ã Áõ¸í¼­) Á¦ÃâÀº º°µµ¾È³» ¿¹Á¤À̸ç,

      Á¦Ãâ¼­·ù Áß ÇãÀ§±âÀç »ç½ÇÀÌ ÀÖ´Â °æ¿ì¿¡´Â ä¿ëÀÌ Ãë¼ÒµÉ ¼ö ÀÖ½À´Ï´Ù.



* ÀÔ»çÁö¿ø ½Ã Áß¿ä»çÇ×À» ²À üũÇϼ¼¿ä!

* ±Ù¹«È¯°æ
±Ù¹«Áö¿ª : °æ±â
±Þ¿©Á¶°Ç : ´ç»ç±ÔÁ¤
* Á¢¼ö°³¿ä

¿À´Ã¸¶°¨

Á¢¼ö±â°£ÀÌ Áö³µ½À´Ï´Ù

¡á Á¢¼ö±â°£   ¡á ¿À´Ã   ¡á ¸¶°¨

2010. 02

  • ÀÏ
  • ¿ù
  • È­
  • ¼ö
  • ¸ñ
  • ±Ý
  • Åä
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28

2010. 03

  • ÀÏ
  • ¿ù
  • È­
  • ¼ö
  • ¸ñ
  • ±Ý
  • Åä
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
* ´ã´çÀÚ Á¤º¸
¸ðÁý±â°£ÀÌ Áö³­ ä¿ëÁ¤º¸ÀÇ °æ¿ì ´ã´çÁ¤º¸´Â °ø°³µÇÁö ¾Ê½À´Ï´Ù.
ÇöÀç ä¿ëÁ¤º¸¸¦ º¹»çÇÕ´Ï´Ù. ÇöÀç ä¿ëÁ¤º¸¸¦ ÇÁ¸°ÆÃÇÕ´Ï´Ù.

µî·Ï : 2010³â 2¿ù 23ÀÏ (È­) 09:43    ÃÖÁ¾¼öÁ¤ : 2010³â 2¿ù 23ÀÏ (È­) 16:35

º» Á¤º¸´Â »ï¼ºÀüÀÚ(ÁÖ) ¿¡¼­ Á¦°øÇÑ ÀÚ·áÀ̸ç, ½ºÄ«¿ìÆ®Àº(´Â) ±× ³»¿ë»óÀÇ ¿À·ù ¹× Áö¿¬, ±× ³»¿ëÀ» ½Å·ÚÇÏ¿© ÃëÇØÁø Á¶Ä¡¿¡ ´ëÇÏ¿© Ã¥ÀÓÀ» ÁöÁö ¾Ê½À´Ï´Ù. º» Á¤º¸´Â ½ºÄ«¿ìÆ®ÀÇ µ¿ÀÇ ¾øÀÌ Àç¹èÆ÷ÇÒ ¼ö ¾ø½À´Ï´Ù.

¢À ½ºÄ«¿ìÆ® ¿¡¼­´Â °ÅÁþ ±¸ÀÎ ±¤°í¿¡ ´ëÇÑ ÇÇÇظ¦ ÃÖ¼ÒÈ­ Çϱâ À§ÇÏ¿© ÇãÀ§ ä¿ë°ø°í¿¡ ½Å°íÁ¦µµ¸¦ ½ÃÇàÇÏ°í ÀÖ½À´Ï´Ù.
°ÅÁþ±¸Àα¤°í¿¡ ´ëÇÑ ±¸Á÷ÀÚÁÖÀÇ»çÇ× ½Å°íÆ÷»ó±ÝÁ¦ ¾È³» ÇãÀ§ ä¿ë°ø°í ½Å°íÇϱâ

±Ù¹«Áö À§Ä¡ º¸±â

±Ù¹«Áö ÁÖ¼Ò

Å©°Ôº¸±â

[ƯÁý±âȹ] ¹ý·ü»ç¹«Á÷

Á÷¾÷µ¸º¸±â

¹ý·ü»ç¹«Á÷À̶õ?º¯..

¸éÁ¢ helper

¸éÁ¢Áú¹®

Àμº ¡Ú¡Ú¡Ú¡Ú
Àû¼º ¡Ú¡Ú¡Ú¡Ú

Special Interview

½ºÆä¼ÈÀÎÅͺä
¹ý·ü »ç¹«Á÷À̶ó´Â ÀÏÀÌ ¾î¶² ÀÏÀÎÁö Àß ¸ð..