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¡á Advanced Process Development ¹× Integration
- Cleaning/CMP/Etch/Lithography (including OPC/RET)/Thin Film (including Silicide)
- High-K/Metal Gate
- SiO2/SiON Gate Dielectrics
- Ultra Low-K
- Ultra Shallow Junction (including RTA and LSA)
- Strain Engineering
- FEOL/BEOL Process Integration
¡á Packaging Expert
- Wafer Level/TSV (Photo, CMP, Low Temp CVD..)
- Wafer Thinning, & sawing, Wafer Level packaging material
- CIS Packaging & Module design, testing, failure analysis
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¡á Device & Reliability Engineering
- Device physics and optimization / Device Reliability (including BEOL reliability)
- Device Modeling (including strain modeling, Pixel for CMOS image sensor )
¡á IC Design
- Analog / Digital /SOC Design
- ISP Algorithm°³¹ß / ISP FW °³¹ß
- Layout
¡á Application
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- Product and Test Engineering
¡á Design Infra Development
- DFM Engineering, Design Rule °³¹ß
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¡á Product Engineering & Test
¡á Factory Automation & IT Engineering
- FAB Automation (Scheduling, Simulation, AMHS)
- IT Engineering (PLM, MIS, MES, FDC)
- Yield Management System( Statistical Analysis, Modeling)
¡á Manufacturing Infra Technology
- Material development and analysis
- Nano-contamination control engineering
¡á Marketing & Customer Engineering
- Product Marketing, Technology Marketing
- Customer Engineering (Technical Interface, Program Management)
¡á Quality Engineering
- Customer interface, Quality system or engineering, Technical support
- Process reliability, Device degradation modeling, Circuit reliability
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