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¡à Software Design / Verification System SW, Computer Architecture, Memory & Storage Algorithm Design, FTL, Flash Memory File System, Journaling File System Design, Linux file system(ext4), Virtual Memory Management, Cache Algorithm,
Dynamic Memory Management Development, Application Processor, Multimedia Processor, Memory Card Controller F/W, Inter-Processor Communication Algorithm Design, Parallel Processing Algorithm for SMP/AMP multi-Processor, HW & SW Performance Trade-off, SW Engineering, Embedded System Test, Test Case Design, Dependability, Fault Tolerant System Test Embedded System Development Process, Performance Analysis, OS, I/O System,
Storage System, Infra(Clear Case, Clear Quest, Test Automation Tool),
Filesystem Failure Analysis
¡à Device Process Oxidation, Photo Resist, Photolithography, Etch, Diffusion, Cleaning, Thin Film, Ion Impantation, CVD, Metallization, Device Isolation, Transistor, Capacitor, Dielectric, SiO2/SiON Gate Dielectrics, High-K/Metal Gate, Device Analysis
¡à Manufacturing Technology - Yield Enhancement: Defect Reduction, Contamination Evaluation Technology, Particle Detection, Gas Impurity Evaluation Technology, Surface/Chemical Analysis Technology, Contamination Technology - Metrology:Pattern Process Inspection, Critical Dimension Measurement
¡à Quality & Reliability Engineering for Semiconductor - Engineering Statistics & Quality: DOE(Design of Experiment), Sampling Methodology,
Virtual Metrology, Multi-Stage SPC (Statistical Process Control),
APC (Advanced Process Control)
Multivariate Modeling & Analysis
- Data Mining: Clustering & Classification, Feature Extraction & Selection,
Dimension Reduction
- Stochastic Modeling & Focasting: Scheduling, Queing
- Reliability Modeling & Availability: System, Software, Component Level
¡à Reliability Technology for Semiconductor Device Reliability(DRAM, Flash), Advanced Gate Stack Reliability, Novel Device Reliability(PCM, MRAM, etc),
Device Characterization and Reliability Modeling, Design-In Reliability, Interconnect Reliability, Electro-migration, Stress-migration, BTS (Bias Temperature Stress), 3D interconnect, Thin Film Stress analysis, Novel Materials for Interconnects Circuit Reliability,
Failure Analysis & Life Time Projection Package level reliability, Solder joint reliability, Board level reliability
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