ÀÏÀß·¯Ã¤¿ë°ü
ä¿ëÁ¤º¸
ÀÎÀç°Ë»ö
±³À°Á¤º¸
ÇìµåÇåÆÃ
½º¸¶Æ®Å¸¿î
ȸ¿ø¼­ºñ½º
À̷¼­ µî·Ï
ä¿ë°ø°í µî·Ï

»ï¼ºÀüÀÚ(ÁÖ) - DSºÎ¹® ¹ÝµµÃ¼¿¬±¸¼Ò °æ·Â»ç¿ø ä¿ë °ø°í






±â¾÷¸í

±â¾÷¼Ò°³


»ï¼ºÀüÀÚ(ÁÖ)

»ï¼ºÀüÀÚÀÇ µðÁöÅÐ ±â¼úÀº °ø°£Àû, ½Ã°£Àû Á¦¾àÀ» ¶Ù¾î³Ñ¾î ±â¼ú°ú ½ÃÀå, ¹®È­ µî ¿ì¸® »ýȰÀÇ Àü¹ÝÀ» º¯È­½Ã..  

¾÷Á¾ Àü±â/ÀüÀÚ/Åë½Å ÀÚº»±Ý
±â¾÷ÇüÅ ´ë±â¾÷ ¸ÅÃâÇöȲ
´ëÇ¥ÀÚ »ç¿ø¼ö
ȸ»çÁÖ¼Ò (443-803) °æ±â ¼ö¿ø½Ã ¿µÅ뱸 ¸Åź3µ¿ 416
  • ÇöÀç ä¿ëÁ¤º¸¸¦ º¹»çÇÕ´Ï´Ù.
  • ÇöÀç ä¿ëÁ¤º¸¸¦ ÇÁ¸°ÆÃÇÕ´Ï´Ù.




Á÷Á¾ ¹ÝµµÃ¼¡¤µð½ºÇ÷¹ÀÌ¡¤±¤ÇÐ
±Ù¹«ÇüÅ Á¤±ÔÁ÷ ä¿ëÁ÷±Þ -
¸ðÁýÀοø 0 ¸í ³ªÀÌ Á¦ÇѾøÀ½
°æ·Â °æ·Â ±Þ¿©Á¶°Ç ¸éÁ¢½ÃÇùÀÇ
Çз ´ëÁ¹ ÀÌ»ó Á¢¼ö±â°£ Á¢¼ö±â°£ÀÌ Áö³µ½À´Ï´Ù
 [ȨÆäÀÌÁöÁ¢¼ö]

Á¢¼ö±â°£ÀÌ Áö³µ½À´Ï´Ù

* ´ã´ç¾÷¹«
»ó¼¼Á¶°Ç

[DSºÎ¹®] ¹ÝµµÃ¼¿¬±¸¼Ò °æ·Â»ç¿ø ä¿ë °ø°í


¡Ü  ¸ðÁýºÎ¹®

   1) Advanced Process & Module Development (DRAM, Flash, Logic, etc.)

      ¡Û Photolithography (e-beam, EUV, OPC/RET, Photo Resist Materials), Dry Etch,Cleaning & CMP,

        Diffusion, Ion Implantation, Metallization, Metrology & Inspection, etc.

      ¡Û High-K/Metal Gate, SiO2/SiON Gate Dielectric, Low-K, Interconnect, etc.

      ¡Û Device Isolation, Transistor, Capacitor, Dielectric, Optics/Mechanical System Design.

      ¡Û Advanced Metrology/Simulation/Image Processing Technique.

         ¡Ø OPC : Optical Proximity Correction (Comput. Litho), MPC : Mask Process Correction.

   2) FEOL/BEOL Process Integration (DRAM / Flash / Logic, etc.)

      ¡Û FEOL/BEOL Process Flow, Physical & Electrical Targets Generations.

      ¡Û Device/Process Test Layout Design and Verification, Test keys Design.

      ¡Û Design rule development, Process Architecture

   3) New Memory

      ¡Û PRAM, STT-MRAM, ReRAM, etc.

   4) TCAD/ECAD

      ¡Û Process & Device/Material Modeling, Circuit Compact/Reliability Modeling

      ¡Û Circuit Simulator Development, SSD Research Experience

      ¡Û System-Level Modeling / Simulation, Virtual Platform, HW / SW Co-Design

      ¡Û Simics/CoWare/SOC Designer User Memory Controller/Memory Architecture

   5) Package Development

      ¡Û Wire Bonding & Flip Chip Package / Wafer Level Package (WLP/TSV)

      ¡Û Thinning ¹× PKG/Chip Warpage Control, Signal/Power/Thermal

      ¡Û Material Development & Failure Analysis

   6) Material Development & Environment Contamination Control

      ¡Û Material(Wafer, PR, Gas, Chemical, Thin Film) Development

      ¡Û FAB Environment Contamination Monitoring & Control

      ¡Û Material & Environment Failure Analysis and Quality Guarantee

         ¡Ø Àü °ø : Àü±âÀüÀÚ, ¹°¸®/±¤ÇÐ, È­ÇÐ/È­°ø, Àç·á/±Ý¼Ó, ±â°è, »ê¾÷°øÇÐ, Ç×°ø¿ìÁÖ°øÇÐ etc.

         ¡Ø ±Ù¹«Áö : »ï¼ºÀüÀÚ(ÁÖ) È­¼ºÄ·ÆÛ½º (°æ±âµµ È­¼º½Ã ¼ÒÀç)


¡Ü  Áö¿øÀÚ°Ý

   ¡Û Çлç ÇÐÀ§ ¼ÒÁöÀÚÀÇ °æ¿ì ÃÖ¼Ò 4³âÀÌ»óÀÇ °ü·Ã ºÎ¹® °æ·Â º¸À¯ÀÚ

   ¡Û ¼®»ç ÇÐÀ§ ¼ÒÁöÀÚÀÇ °æ¿ì ÃÖ¼Ò 2³âÀÌ»óÀÇ °ü·Ã ºÎ¹® °æ·Â º¸À¯ÀÚ

   ¡Û ¹Ú»ç ÇÐÀ§ ¼ÒÁöÀÚ ¹× 2013³â À̳» ¹Ú»çÇÐÀ§ Ãëµæ¿¹Á¤ÀÚ

   ¡Û ±ºÇÊ ¹× ¸éÁ¦ÀÚ, ÇØ¿Ü ¿©Çà¿¡ °á°Ý »çÀ¯°¡ ¾ø´Â ÀÚ


¡Ü  Á¢¼ö±â°£ ¹× Á¢¼ö¹æ¹ý

   1) Á¢¼ö±â°£

      ¡Û 2013³â 04¿ù 01ÀÏ (¿ù) ~ 2013³â 04¿ù 09ÀÏ (È­) 23:50 ±îÁö

   2) Á¢¼ö¹æ¹ý

      ¡Û ´ç»ç ȨÆäÀÌÁö Á¢¼ö ÀÌ¿ë(ÀÚ»ç¾ç½Ä ´Ù¿î)

         ¡Ø www.samsungcareers.com >> °æ·Âä¿ë >> DSºÎ¹® ¹ÝµµÃ¼¿¬±¸¼Ò °æ·Â»ç¿ø ä¿ë °ø°í >>

            °ø°í ÇÏ´ÜÀÇ ''Áö¿ø¼­ ÀÛ¼ºÇϱâ >> °ø°í Áö¿ø¼­ ÀÛ¼º'' Ŭ¸¯

         ¡Ø¹Ýµå½Ã Çϱâ ÷ºÎ ¾ç½Ä¿¡ ¸ÂÃç ÀÛ¼º ºÎŹ µå¸³´Ï´Ù


¡Ü  ÀüÇü ÀýÂ÷

   ¡Û Áö¿ø¼­ÀÛ¼º >> Áö¿øÀڰݰËÅä >> ¸éÁ¢ÀüÇü >> °Ç°­°ËÁø >> ÃÖÁ¾ÇÕ°Ý


¡Ü  ±âŸ

   ¡Û À̷¼­ °ËÅä ÈÄ ¼­·ù ÀüÇü °á°ú´Â E-mail·Î °³º° ¹ß¼ÛµÉ ¿¹Á¤À̸ç, ÇÕ°ÝÀÚ¿¡ ùÚÇÏ¿© 4¿ùñé¿¡ ¸éÁ¢ÀÌ ½Ç½ÃµÉ ¿¹Á¤ÀÔ´Ï´Ù.

   ¡Û Á¢¼öµÈ ¼­·ù´Â ÀÏü ¹ÝȯÇÏÁö ¾ÊÀ¸¸ç, ÇãÀ§»ç½ÇÀÌ ÀÖ´Â °æ¿ì ÀԻ簡 Ãë¼ÒµË´Ï´Ù.

   ¡Û ÀÔ»çÁö¿øÀÚ²²¼­´Â ÀÔ»çÁö¿ø ½ÃºÎÅÍ Ã¤¿ëÀüÇü Àü °úÁ¤¿¡ °ÉÃÄ Àü/ÇöÁ÷ Á÷ÀåÀÇ ¿µ¾÷ºñ¹ÐÀ» Ä§ÇØÇÏ´Â ÀÏÀÌ ¾øµµ·Ï °¢º°È÷

      À¯ÀÇÇϽñ⠹ٶø´Ï´Ù.

   ¡Û ´ã´çÀÚ : »ï¼ºÀüÀÚ ¹ÝµµÃ¼¿¬±¸¼Ò ÃÖ»óÇõ(031-208-7138, sdf.choi@samsung.com)



* ÀÔ»çÁö¿ø ½Ã Áß¿ä»çÇ×À» ²À üũÇϼ¼¿ä!

* ±Ù¹«È¯°æ
±Ù¹«Áö¿ª : °æ±â
±Þ¿©Á¶°Ç : ¸éÁ¢½ÃÇùÀÇ
* Á¢¼ö°³¿ä

¿À´Ã¸¶°¨

Á¢¼ö±â°£ÀÌ Áö³µ½À´Ï´Ù

¡á Á¢¼ö±â°£   ¡á ¿À´Ã   ¡á ¸¶°¨

2013. 04

  • ÀÏ
  • ¿ù
  • È­
  • ¼ö
  • ¸ñ
  • ±Ý
  • Åä
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
* ´ã´çÀÚ Á¤º¸
¸ðÁý±â°£ÀÌ Áö³­ ä¿ëÁ¤º¸ÀÇ °æ¿ì ´ã´çÁ¤º¸´Â °ø°³µÇÁö ¾Ê½À´Ï´Ù.
ÇöÀç ä¿ëÁ¤º¸¸¦ º¹»çÇÕ´Ï´Ù. ÇöÀç ä¿ëÁ¤º¸¸¦ ÇÁ¸°ÆÃÇÕ´Ï´Ù.

µî·Ï : 2013³â 4¿ù 2ÀÏ (È­) 10:49    ÃÖÁ¾¼öÁ¤ : 2013³â 4¿ù 2ÀÏ (È­) 10:49

º» Á¤º¸´Â »ï¼ºÀüÀÚ(ÁÖ) ¿¡¼­ Á¦°øÇÑ ÀÚ·áÀ̸ç, ½ºÄ«¿ìÆ®Àº(´Â) ±× ³»¿ë»óÀÇ ¿À·ù ¹× Áö¿¬, ±× ³»¿ëÀ» ½Å·ÚÇÏ¿© ÃëÇØÁø Á¶Ä¡¿¡ ´ëÇÏ¿© Ã¥ÀÓÀ» ÁöÁö ¾Ê½À´Ï´Ù. º» Á¤º¸´Â ½ºÄ«¿ìÆ®ÀÇ µ¿ÀÇ ¾øÀÌ Àç¹èÆ÷ÇÒ ¼ö ¾ø½À´Ï´Ù.

¢À ½ºÄ«¿ìÆ® ¿¡¼­´Â °ÅÁþ ±¸ÀÎ ±¤°í¿¡ ´ëÇÑ ÇÇÇØ¸¦ ÃÖ¼ÒÈ­ Çϱâ À§ÇÏ¿© ÇãÀ§ ä¿ë°ø°í¿¡ ½Å°íÁ¦µµ¸¦ ½ÃÇàÇϰí ÀÖ½À´Ï´Ù.
°ÅÁþ±¸Àα¤°í¿¡ ´ëÇÑ ±¸Á÷ÀÚÁÖÀÇ»çÇ× ½Å°íÆ÷»ó±ÝÁ¦ ¾È³» ÇãÀ§ ä¿ë°ø°í ½Å°íÇϱâ

±Ù¹«Áö À§Ä¡ º¸±â

±Ù¹«Áö ÁÖ¼Ò

(443-803) °æ±â ¼ö¿ø½Ã ¿µÅ뱸 ¸Åź3µ¿ 416

Å©°Ôº¸±â

[ƯÁý±âȹ] ¹ý·ü»ç¹«Á÷

Á÷¾÷µ¸º¸±â

¹ý·ü»ç¹«Á÷À̶õ?º¯..

¸éÁ¢ helper

¸éÁ¢Áú¹®

Àμº ¡Ú¡Ú¡Ú¡Ú
Àû¼º ¡Ú¡Ú¡Ú¡Ú

Special Interview

½ºÆä¼ÈÀÎÅͺä
¹ý·ü »ç¹«Á÷À̶ó´Â ÀÏÀÌ ¾î¶² ÀÏÀÎÁö Àß ¸ð..

À¯»çÁ÷Á¾ÀÇ Ã¤¿ë Á¤º¸